| 摘要 |
PROBLEM TO BE SOLVED: To suppress cracking of a ceramic board due to warpage when heat cycle is used. SOLUTION: The production process of a substrate for power module where a circuit layer for solder joining a semiconductor chip is soldered to a ceramic board 11 comprises a laser processing step for forming a groove-like scribe line 31 by irradiating at least one surface 21 of a substantially planar ceramic base material 20, an etching step for removing a heat denaturation layer 33 formed on the inner surface 31a of the scribe line 31 in the laser processing step and denaturized glassy with the heat of the laser light, and a step for dividing the ceramic base material 20 into individual ceramic boards 11 along the scribe line 31. COPYRIGHT: (C)2008,JPO&INPIT |
