| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer circuit board, by which any connection failure in a connection conductor is hard to occur after a lamination, while a preparation process of a resin film before the lamination being simple and a handling of each member in the preparation process being easy and a manufacturing cost being able to be suppressed, and to provide a cheap multilayer circuit board with a high reliability manufactured by the method. SOLUTION: This invention relates to a method of manufacturing a multilayer circuit board 100 in a predetermined position of a conductor pattern 2a used for an electric connection, comprising: a through hole formation process of forming a through hole 3b penetrating the conductor pattern 2a and a resin film 30; a conductive paste filling process of filling up the through hole 3b with conductive paste 4; and a heating pressurization process of sintering the conductive paste 4, while laminating a plural sheet of resin films 30a to 30f in which the through hole 3b is filled up with the conductive paste 4, and heating and pressurizing a lamination, and mutually laminating the resin films 30a to 30f. COPYRIGHT: (C)2008,JPO&INPIT |
