| 摘要 |
There is provided a head including a chip 10 that has a semiconductor substrate 11 , heating elements 12 disposed on the semiconductor substrate 11 , coating layers 14 disposed on the semiconductor substrate 11 and having nozzles 14 a arranged in regions above the respective heating elements 12 , and individual channels 14 b each communicating with the outside and the region above the corresponding heating element 12 , wherein the semiconductor substrate 11 does not have a through hole communicating with each individual channel 14 b; a ink feed member 21 having a common channel 21 b, the ink feed member 21 being bonded to the chip 10 in such a manner that the common channel 21 b communicates with the individual channels 14 b; and a top 22 disposed on the chip 10 and the ink feed member 21 so as to seal the opening of the common channel 21 b.
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