| 摘要 |
An epoxy resin composition (1) comprising a tetramethyl- bisphenol F type epoxy resin, a curing agent, a filler, and a silane coupling agent, wherein the silane coupling agent contains an aminosilane coupling agent having a primary amino group; an epoxy resin composition (2) comprising a tetramethylbisphenol F type epoxy resin, a curing agent, and a filler, wherein the curing agent contains a specific phenol; and an epoxy resin composition (3) comprising a tetramethylbisphenol F type epoxy resin, a curing agent, and a filler, wherein the filler is a specific one. These epoxy resin compositions are excellent both in reliability of peeling resistance and swell characteristics in reflowing and in filling properties in molding, thus being favorable for encapsulation of electronic circuit devices. |
