| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure which cools a heat generating part by using semiconductor substrates as heat sinks or thermoelectric elements, and also to provide an electronic apparatus having the structure. SOLUTION: The cooling structure comprises: a plurality of semiconductor substrates 10 that are arranged almost parallel and mutually opposed in one direction keeping spaces between them; a base plate 18 for fixing on which the semiconductor substrates 10 are fixed almost perpendicularly; and a filling material 16 which has electrically insulating and thermally conductive properties and is filled between the spaces at fixing portions of the semiconductor substrates 10 so that the semiconductor substrates 10 and a base plate for fixing are integrally fastened, wherein the base plate for fixing is mounted on a surface of the heat generating part 22 to cool the heat generating part. The heat from the heat generating part is transferred to the semiconductor substrates 10, and is dissipated. Alternatively, the plurality of semiconductor substrates 10 are p-type Si substrates and n-type Si substrates alternately arranged in one direction and series-connected, and are driven as a Peltier element or a Seebeck element. The semiconductor substrates 10 are mechanically fixed to the base plate for fixing with the filling material in a stable manner to construct a cooling structure of a simple constitution. COPYRIGHT: (C)2008,JPO&INPIT |
