| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pressure bonding unit structure for surely keeping parallel flatness of a pressure bonding tool free from temperature fluctuation in the pressure bonding tool at bonding, fluctuation of hardening properties of an adhesive, and bonding failure since the pressure bonding tool material with uniform deformation of expansion or the like in a flexible printing circuit board is used, while the high precision, low cost, and high reliability are satisfied. <P>SOLUTION: In the pressure bonding unit structure, Si<SB>3</SB>N<SB>4</SB>ceramic material is used as upper and lower clamping tools 7, 8. The pressure bonding unit structure has a structure having a holding members 3, 4, 5, 6 disposed for keeping the pressure bonding tools 7, 8 parallel, and having a plurality of heating members 9 placed merely in upper holding portion. <P>COPYRIGHT: (C)2008,JPO&INPIT |
