| 摘要 |
A dry etch apparatus is provided to secure reliability and stability by removing moisture from an outer circumference of a chuck by using a heating member. A wafer is loaded on a chuck(120). A process chamber(110) includes a space for performing a wafer etch process. The chuck is stored in the process chamber. A heating member is formed to maintain constantly temperature of an outer circumference of the chuck. The heating member is formed at a bottom surface or a lateral surface of the chuck. The heating member is formed at a bottom surface or a lateral surface of the process chamber. The heating member is a heating coil(130) or a heating cartridge.
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