发明名称 |
Semiconductor device and process for fabrication thereof |
摘要 |
A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
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申请公布号 |
US7387914(B2) |
申请公布日期 |
2008.06.17 |
申请号 |
US20060379921 |
申请日期 |
2006.04.24 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TAKEDA SHINJI;MASUKO TAKASHI;YUSA MASAMI;KIKUCHI TOORU;MIYADERA YASUO;MAEKAWA IWAO;YAMASAKI MITSUO;KAGEYAMA AKIRA;KANEDA AIZOU |
分类号 |
H01L21/48;H01L21/52;H01L21/50;H01L21/58;H01L23/495 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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