发明名称 |
SIMULTANEOUS OFFSET DUAL SIDED LASER SHOCK PEENING USING LOW ENERGY LASER BEAMS |
摘要 |
A method for laser shock peering (LSP) an article (108) by simultaneously firing low energy first and second laser beams (102, 103) to form pairs of longitudinally spaced apart (LD) first and second laser shock peered spots (158, 159) that are on opposite sides of the article (108), simultaneously laser shock peered, and transversely offset (OS) from each other. Each of the low energy first and second laser beams (102, 103) having a level of energy of between 1-10 joules.
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申请公布号 |
CA2398339(C) |
申请公布日期 |
2008.06.17 |
申请号 |
CA20022398339 |
申请日期 |
2002.08.15 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
ROCKSTROH, TODD JAY;MANNAVA, SEETHARAMAIAH;SUH, UI WON |
分类号 |
B23K26/00;B24C1/10;C21D10/00;F01D5/28 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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