MOLD FOR PUNCHING A PRINTED CIRCUIT FILM

摘要

A mold for punching a printed circuit film is provided to extend life span of the mold by fabricating an insert member and a punch using materials having a superior hardness. A mold(1000) for punching a printed circuit film comprises a die(100) for supporting a base material and a punch(200) mounted on the die. The printed circuit film is made by punching the base material. The punch strikes the base material supported by the die while moving up/down. The die includes a holder plate(10) and an insert member(20). The insert member is detachably coupled to the holder plate and has hardness larger than that of the holder plate. The insert member has an opening into which the punch is inserted.