| 摘要 |
PROBLEM TO BE SOLVED: To provide an interposer that can laminate and mount semiconductor chips without forming a through electrode, as well as a semiconductor chip unit and a semiconductor chip laminated module using this interposer. SOLUTION: The interposer has a through electrode 32 prepared on a base substrate 31, a thin film wiring layer 33 prepared on the first principal surface of the base substrate 31, and a post electrode 34 prepared on the first principal surface of the thin film wiring layer 33, wherein the through electrode 32, the thin film wiring layer 33, and the post electrode 34 are electrically interconnected, i.e., a surface terminal electrode 14 of a semiconductor chip 1 mounted in a region surrounded by the post electrode 34 in the first principal surface of the thin film wiring layer 33 is joined with the surface electrode pad of the thin film wiring layer 33 rewired through the thin film layer 33, electrically connected to the post electrode 34, further rewired from this post electrode 34 through the through electrode 32 of the base substrate 31, and electrically connected to a terminal electrode 35 prepared on a second principal surface of the base substrate 31. COPYRIGHT: (C)2007,JPO&INPIT
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