A process of assembling a connector electrode to electronic, preferably semiconductor, components

摘要

1,139,035. Welding by pressure. BROWN, BOVERI & CO. Ltd. 29 July, 1966 [31 July, 1965], No. 34268/66. Heading B3R. [Also in Division H1] As shown, an electrode 2 having an enlarged head 3 is ultrasonically welded to a semiconductor wafer 1 by means of a hollow sonotrode 4. The electrode 2 is produced by passing an aluminium wire through the sonotrode 4 and forming the head 3 by melting or by cold deformation. Wafer 1 may be of N-type or P- type silicon, the resulting contacts being rectifying or ohmic respectively. The electrode may be welded to or through a thin metal coating of, for example, nickel or gold on the wafer, or through a coat of protective paint.