| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To realize a package for housing an electronic part that a base and a lid are sealed up with sealing material, and that the sealing material can be efficiently melted and efficiently heated with an irreducibly minimum heat. <P>SOLUTION: The package for housing the electronic part is equipped with the base 1 mounted with an electronic part 4 on its surface, the lid 2 which is bonded to the base 1 through the intermediary of the annular sealing material 3 so as to cover the electronic part 4, and a heating material 5 which is located inside of the outer periphery of the sealing material 3 as a whole. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
