| 摘要 |
A semiconductor apparatus that comprises a semiconductor chip having a first surface including an external connection terminal and a second surface opposing the first surface, a cap having a recessed part that accommodates the semiconductor chip, and a bonding member for bonding the second surface of the semiconductor chip with a bottom of the recessed part of the cap. In a central region excluding corners of the second surface, the second surface of the semiconductor chip is bonded with the bottom of the recessed part of the cap by the bonding member. By an entire surface of the semiconductor chip not bonded with the cap, an influence of thermal stress from the cap can be reduced.
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