| 摘要 |
A semiconductor device includes a die, a substrate, a heat spreader and a plurality of signal interconnects extending from the die. The heat spreader has a base and a plurality of fins. The heat spreader is mounted on the substrate in such a way that the base of the head spreader is in thermal communication with the die. The fins protrude downwardly into the substrate conducting heat away from the die and into the substrate.
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