发明名称 SURFACE ACOUSTIC WAVE ELEMENT CHIP AND SURFACE ACOUSTIC WAVE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a surface acoustic wave device, the steepness and the attenuation of which are improved by properly combining a thinning weighting depending on with/without reflection of a surface acoustic wave on IDTs with a thinning weighting depending on with/without excitation of the surface acoustic wave. SOLUTION: A surface acoustic wave chip includes: a first IDT 14, a second IDT 16, and a third IDT 18 arranged along a propagation direction of a surface acoustic wave on a piezoelectric substrate; and a pair of reflectors provided by sandwiching the IDTs 14, 16, 18. Each of the IDTs 14, 16, 18 is formed intermingledly with: electrode cells A capable of exciting and reflecting the surface acoustic wave; electrode cells B capable of exciting but not reflecting the surface acoustic wave; an electrode cell C incapable of exciting the surface acoustic wave but capable of reflecting the surface acoustic wave; and an electrode cell D not exciting the surface acoustic wave nor reflecting the surface acoustic wave. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007124440(A) 申请公布日期 2007.05.17
申请号 JP20050315732 申请日期 2005.10.31
申请人 EPSON TOYOCOM CORP 发明人 YAMANAKA KUNIHITO
分类号 H03H9/145;H03H9/25;H03H9/64 主分类号 H03H9/145
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