发明名称 |
Semiconductor chip having bond pads |
摘要 |
A semiconductor package includes a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern, The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region.
|
申请公布号 |
US2007108562(A1) |
申请公布日期 |
2007.05.17 |
申请号 |
US20060616852 |
申请日期 |
2006.12.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SONG YOUNG-HEE;CHOI IL-HEUNG;KIM JEONG-JIN;SOHN HAE-JEONG;LEE CHUNG-WOO |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|