| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a terminal fitting from being brought into a non-soldered condition when reflow soldering is applied. <P>SOLUTION: A plurality of the terminal fittings 30 are vertically divided into two stages and press-fitted in a connector housing 10. The lower end part of each terminal fitting 30 is formed as a connecting part 33 connected to the conductive passage of a substrate 50 by flow soldering. Before the connecting housing 10 is placed on the substrate 50, the connecting part 33A of the upper stage terminal fitting 30A is positioned lower than the connecting part 33B of the lower stage terminal fitting 30B corresponding to the difference of the amount of fluctuation of the upper stage terminal fitting 30A and the lower stage terminal fitting 30B which fluctuate as the connector housing 10 thermally expands along with reflow soldering. Accordingly, the respective height positions of the upper stage terminal fitting 30A and the lower stage terminal fitting 30B can be set at the same positions after the reflow soldering is applied. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
