DEVICE AND METHOD FOR SELECTING SEMICONDUCTOR CHIP, AND FOR POLISHING SEMICONDUCTOR CHIP, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To uniform the thickness of a semiconductor chip 14 after it is polished, and to permit the semiconductor chip 14 to have no polishing trace extending in a specified direction for lowering strength. SOLUTION: A semiconductor chip having a rectangular rear surface which is polished in random direction within its plane is measured for an angleθformed by the extending direction of polishing trace on a rear surface 16 and the short-side direction A of the rear surface 16, and the measured angleθis used as a reference to judge whether or not the semiconductor chip 14 is defective. COPYRIGHT: (C)2006,JPO&NCIPI