| 摘要 |
PROBLEM TO BE SOLVED: To realize an improvement in the mounting performance of an electronic component by providing a fluidity property to an adhesive layer upon formation of multiple layers of a substrate material to avoid the laminate of the substrate material from being strained in a wavy manner. SOLUTION: A conductor pattern 15 is formed on one surface of an insulating substrate material 11, and a plurality of nonconductive projections 13 are provided on the other surface of the insulating substrate material 11. COPYRIGHT: (C)2006,JPO&NCIPI |
