发明名称 COMPOSITE, PREPREG USING THE SAME, METAL FOIL-CLAD LAMINATE PLATE, CIRCUIT BOARD AND METHOD FOR PRODUCING THE CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a composite sufficiently excellent in adhesive reliability, sufficiently suppressed in generation of resin powder and fiber liable to fall off, to provide a prepreg using the composite, and to provide a metal foil-clad laminate plate using the composite. SOLUTION: The composite settling the above problems is a composite 100 which is obtained by impregnating a fiber sheet 101 with a curable resin composition 102 and gives a cured product of the curable resin composition and having 100-2,000 MPa storage elastic modulus at 20°C. The curable resin composition has≥30,000 weight-average molecular weight, contains an acrylic polymer containing 2-20 mass% glycidyl acrylate as a polymerizable component and has 2-36 epoxy number. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006117888(A) 申请公布日期 2006.05.11
申请号 JP20040310030 申请日期 2004.10.25
申请人 HITACHI CHEM CO LTD 发明人 TAKANO MARE;KAMIYA MASAMI
分类号 C08J5/24;B32B15/08;C08L63/00;H05K1/03;H05K1/11;H05K3/40 主分类号 C08J5/24
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