| 摘要 |
PROBLEM TO BE SOLVED: To provide an anaerobic curing adhesive having a low curing shrinkage and a low heat expansion. SOLUTION: The anaerobic curing composition comprises (a) a compound having at least one radically polymerizable functional group, (b) an organic peroxide, (c) an o-benzoic sulfimide, (d) an organic fine powder of a vinyl polymer with an average particle size of 0.1-100μm and (e) fumed silica. Preferably, the composition contains 0.1-5 pts.wt. component (b), 0.1-5 pts.wt. component (c), 10-50 pts.wt. component (d) and 10-50 pts.wt. component (e) to 100 pts.wt. component (a) and the total amount of component (d) and component (e) is 30-90 pts.wt. to 100 pts.wt. component (a). COPYRIGHT: (C)2006,JPO&NCIPI
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