| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of bonding a semiconductor chip that dispenses with a large-scaled ultrasonic packaging apparatus. <P>SOLUTION: The method of bonding the semiconductor chip, having the steps of bringing the electrode terminal 14 of the semiconductor chip 10 into contact with the electrode terminal of the substrate 12, and applying a supersonic vibration to bond the electrode terminals of the semiconductor chip 10 and the substrate 12 includes the steps of building an ultrasonic vibrator 16 into one side of the semiconductor chip 10 or the substrate 12, and mounting the semiconductor chip 10 in the substrate 12 by the ultrasonic vibration generated by making this ultrasonic vibrator 16 oscillate. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
