| 摘要 |
PROBLEM TO BE SOLVED: To obtain a curing type resin composition that shows not only excellent initial adhesion to inorganic materials such as, glass, metals, silicon oxide, silicon nitride, aluminum oxide, tin oxide, titanium oxide or indium-tin oxide but causes no cissing in coating and can form thin cured films, and in addition, exhibits good adhesion even under wet conditions. SOLUTION: The curing type resin composition comprises (A) a urethane (meth)acrylate with a number-average molecular weight of 4,000 to 14,000, (B) a compound represented by formula (1), (C) a compound represented by formula (2) or formula (3), and (D) a silicone oil bearing a polymerizable functional group in the molecule. COPYRIGHT: (C)2006,JPO&NCIPI
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