发明名称 Process for packaging plastic materials like hot melt adhesives
摘要 <p>A method for packaging plastic material using a film to surround the material, and more particularly to a method for packaging hot melt adhesives, the resulting package formed thereby, and the film composition used therein. The method is preferably a coextrusion process for packaging a pressure sensitive hot melt adhesive by extruding a hot melt adhesive through a die orifice, and coextruding a wax-based polymeric film to surround the hot melt adhesive. The coated adhesive may then be formed into individual packaged units having a finite size and shape. The polymeric film comprises a composition having at least 25% by weight of a wax material, an enthalpy of fusion of at least about 100 J/g, and an elongation value at break of at least about 100%. Any type of hot melt adhesive formulation can be packaged or surrounded by the polymeric film in the process. Also, the specific enthalpy of fusion desired and/or elongation value at break desired for the polymeric film can be obtained by blending an appropriate amount of partially crystalline ethylene-based polymer together with a thermoplastic elastomeric block copolymer and/or an ethylene based or propylene-based elastomer.</p>
申请公布号 AU2005302486(A1) 申请公布日期 2006.05.11
申请号 AU20050302486 申请日期 2005.10.28
申请人 BOSTIK, INC. 发明人 NICOLAS E. SAJOT;MICHAEL A. NEPERUD;DOMINIQUE CHIARABINI;ATUL MEHTA;CHRISTOPHE MOREL-FOURRIER
分类号 B65B63/08;B65D65/46 主分类号 B65B63/08
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