SYSTEM FOR AIRFLOW MANAGEMENT IN ELECTRONIC ENCLOSURE, CENTRAL ELECTRONICS COMPLEX AND AIRFLOW MANAGEMENT SYSTEM (SYSTEM FOR AIRFLOW MANAGEMENT IN ELECTRONIC ENCLOSURE)

摘要

PROBLEM TO BE SOLVED: To attain a significantly large heat load of logic, I/O memory and power supplies in the electronic enclosures.

SOLUTION: The system for airflow management in the electronic enclosure includes a backplane assembly having at least one backplane, at least one daughter card and components disposed on the daughter card oriented to facilitate front-to-back airflow, wherein inlet cooling air impinges on the backplane assembly and splits into at least two flow portions in different directions along a surface defining the back plane assembly.

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