| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus which does not cause the dielectric breakdown of a substrate due to the generation of abnormal arc discharge in reverse sputtering, without using an expensive high-frequency facility. SOLUTION: This sputtering apparatus comprises: an electric power source that employs a pulsed direct current; a substrate holder that is composed of a metal such as Ti and Al, which is hardly sputtered and is hardly oxidized, and that makes the metal at least in a part which faces a plasma-generating space, exposed to the space; and a changeover switch for switching a load of pulsed voltage between a side of a substrate to be treated and a target side, to easily perform reverse sputtering and regular sputtering in the same apparatus. COPYRIGHT: (C)2006,JPO&NCIPI
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