| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a positioning jig for soldering a plurality of substrates to a heat radiating plate, wherein its accurate positioning and its easy cooled-off removal from the substrates are made compatible with each other. <P>SOLUTION: The positioning jig 1 is the one for positioning insulating substrates 12 on a heat-radiating plate 11. The positioning jig 1 has an upper-frame jig 23, having a positioning portion for so contacting it with one end of each insulating substrate 12 mounted on the heat-radiating plate 11 as to position each insulating substrate 12, and has first and second central jigs 24, 25 having respectively contact portions 24b, 25b each of which is so disposed facing the positioning portion of the upper-frame jig 23 as to interpose each insulating substrate 12 between them and makes contact with the other end-portion of each insulating substrate 12. Each of the contacting portions 24b, 25b includes an inclined portion having inclining sense such that its lower portion interposes a larger interval between the upper-frame jig 23 and it than the interval interposed by its upper portion as to be contacted with the other end-portion of each insulating substrate 12 by the inclined portion. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
