| 摘要 |
PROBLEM TO BE SOLVED: To provide a package structure for a piezoelectric device and the piezoelectric device, that is less likely to be influenced by excess solder etc., even if a sealed hole is arranged near the mounting portion. SOLUTION: This piezoelectric device here is a device 10, wherein an integrated circuit 16 is mounted on the bottom face of a package base 12, a piezoelectric oscillating piece 18 is mounted above the integrated circuit 16, respectively, and a through hole 24 is formed for connecting the interior side and the exterior side of the package base 12. The through hole 24 is so structured as to have a bent part in between an opening, formed in the external side of the package base 12 and an opening formed in the internal side of the package base 12. COPYRIGHT: (C)2006,JPO&NCIPI
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