发明名称 |
Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound |
摘要 |
A semiconductor package contains a metal leadframe that has been specially treated by roughening it with a chemical etchant. The roughening process enhances the adhesion between the leadframe and the molten plastic during the encapsulation of the leadframe and thereby reduces the tendency of the package to separate when exposed to moisture and numerous temperature cycles. In one embodiment, the leadframe made of copper is roughened with a chemical etchant that contains sulfuric acid and hydrogen peroxide.
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申请公布号 |
US2006097366(A1) |
申请公布日期 |
2006.05.11 |
申请号 |
US20050292769 |
申请日期 |
2005.12.02 |
申请人 |
NS ELECTRONICS BANGKOK (1993) LTD. |
发明人 |
SIRINORAKUL SARAVUTH;LAYSON ARLENE V.;NONDHASITTHICHAI SOMCHAI;CHUA YEE H. |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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