发明名称 MICROELECTRONICS PACKAGE AND METHOD
摘要 A lightwire segment in the form of an elongated substrate frame composed of a flat flexible thin elongated sheet of plastic dielectric material having a copper film laminated on at least one side; a plurality of cavities longitudinally spaced along the elongated substrate, a LED diode having first and second contacts embedded in each of the cavities of the substrate; the copper film on one side of the substrate defining two interconnects separated by a dielectric space, one interconnect having a tab bonded to the first contact of each LED diode, and the other interconnect having a tab bonded to the second contact of each LED diode. A lightwire made from a plurality of segments that are bonded together in series or parallel. A micropackage made from a substrate frame composed of a flat flexible thin sheet of plastic dielectric material having a copper film laminated on one side defining rows and columns of component sites separated from one another by thin webs to be readily detached from the substrate frame. The micropackage has indexing elements to position the substrate frame relative to a machine that can pick the component sites out of the frame. Each component site defines a cavity formed in the substrate, and the copper film laminated on the substrate defines two separated interconnects, each having a tab extending into the cavity formed in the substrate. An electrical component having contacts is positioned in the cavity and its contacts are bonded to the tabs.
申请公布号 WO2006044739(A2) 申请公布日期 2006.04.27
申请号 WO2005US37158 申请日期 2005.10.18
申请人 INTRAGLOBAL CORPORATION;GREGORY, JOHN 发明人 GREGORY, JOHN
分类号 H02H1/00;H01L33/48 主分类号 H02H1/00
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