发明名称 |
Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same |
摘要 |
A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection terminals. The resin member contains a resin and 60 to 90% by weight of spherical filler.
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申请公布号 |
US2006087045(A1) |
申请公布日期 |
2006.04.27 |
申请号 |
US20050224821 |
申请日期 |
2005.09.13 |
申请人 |
YAMANO TAKAHARU;ARAI TADASHI;MACHIDA YOSHIHIRO |
发明人 |
YAMANO TAKAHARU;ARAI TADASHI;MACHIDA YOSHIHIRO |
分类号 |
H01L23/28 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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