| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processing method of flexible circuit board for adequately controlling flow of sealing material on the occasion of mounting component to the same flexible circuit board. <P>SOLUTION: A sealing material 20 is filled in the periphery of chip components in the component mounting part on the board for mounting chip component 10 on the flexible circuit board. In the flexible circuit board processing method, wettability to the sealing material is enhanced by previously conducting reforming process to the front surface A of the component mounting portion. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
