| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology which can confirm a semiconductor wafer inside a CMP device of an opaque structure. SOLUTION: The CMP device 100 is a semiconductor manufacturing equipment which chemically and mechanically polishes a wafer 1 composed of silicon to the surface of which a metal wiring is exposed. The CMP device 100 comprises a cabinet (B) for shading light which generates a photovoltaic effect in a pn junction of silicon, and the cabinet (B) comprises a light source for irradiating light of a wavelength of 400 nm or below or light of a wavelength of 900 nm to 1,080 nm, and a camera (C) which can image the wafer 1 irradiated by the light source. COPYRIGHT: (C)2006,JPO&NCIPI
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