Optische oder optoelektronische Anordnung mit mindestens einem auf einem Metallträger angeordneten optoelektronischen Bauelement

摘要

A lead frame (1) for receiving and contacting electrical and/or optoelectronic components comprises at least two regions (10,11) of different thicknesses (d1,d2). Preferably at least one of the regions has a reduced thickness and can hold an optical, electrical or optoelectronic component. An independent claim is also included for a component mounted as above.