| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame for power LED in which assembling work of components is not required, the occurrence rate of defective products is lower and manufacturing cost is relatively low, and to provide a manufacturing process of a lead frame for power LED in which assembling work of components is not required, the occurrence rate of defective products is low, manufacturing cost is relatively low and processing speed is high. <P>SOLUTION: A lead frame for power LED in which a heat sink portion 1 and a lead portion 3 at least on one side are made integrally of the same metal material. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
