| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform compression mounting operation quickly while suppressing impact load at the time of compression mounting an electronic component on a substrate. <P>SOLUTION: Impact load can be controlled at the time of touching an electronic component to a substrate by driving a nozzle 19, an electronic component being sucked and compression mounted by the nozzle 19, and a load cell 26 upward to compensate for the total weight thereof by means of a VCM 14. After the electronic component is touched to the substrate, the driving force is directed downward and pressing force of the electronic component against the substrate is increased gradually up to a set level. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
