发明名称 Preparation of microelectromechanical system device using an anti-stiction material and selective plasma sputtering
摘要 A method for preparing a microelectromechanical system (MEMS) device for subsequent processing is disclosed. The method includes establishing an anti-stiction material on exposed surfaces of the MEMS device. The exposed surfaces include at least an interior surface of a chamber and an external surface of the MEMS device. The anti-stiction material is selectively removed from at least a portion of the external surface via a plasma sputtering process under controlled conditions.
申请公布号 US7443001(B2) 申请公布日期 2008.10.28
申请号 US20060541993 申请日期 2006.10.02
申请人 HELWETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 CHEN CHIEN-HUA;REBOA PAUL FELICE;HALUZAK CHARLES C.
分类号 H01L21/00;H01L21/302 主分类号 H01L21/00
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