Systems and methods that selectively modify liner induced stress

摘要

The present invention facilitates semiconductor fabrication by providing methods of fabrication that selectively apply strain to multiple regions of a semiconductor device. A semiconductor device having one or more regions is provided ( 102 ). A strain inducing liner is formed over the semiconductor device ( 104 ). A selection mechanism, such as a layer of photoresist or UV reflective coating is applied to the semiconductor device to select a region ( 106 ). The selected region is treated with a stress altering treatment that alters a type and/or magnitude of stress produced by the selected region ( 108 ).