| 摘要 |
An electroless copper plating solution is provided to form a copper plating film having excellent adhesive force and low electrical resistance, a method for preparing the electroless copper plating solution is provided, and an electroless copper plating method is provided to form an electroless copper plating film having stable and improved adhesive force and low electrical resistance by using the electroless copper plating solution. An electroless copper plating solution comprises a copper salt, a complex agent, a reducing agent, and a pH adjusting agent, wherein the plating solution comprises an acid solution of 2,2'-dipyridyl and has a pH range of 11.5 to 13.0. The electroless copper plating solution has mole ratios of the complex agent and the reducing agent to the copper salt of 1:3 and 1:4 respectively. The plating solution comprises 0.01 to 0.05 mole/L of a copper salt, 0.03 to 0.15 mole/L of a complex agent, 0.04 to 0.20 mole/L of a reducing agent, 0.1 to 0.2 mole/L of a pH adjusting agent, and 0.1 to 0.5 mmol/L of an acid solution of 2,2'-dipyridyl. A method for preparing an electroless copper plating solution comprises the steps of: sequentially dissolving a copper salt, a complex agent, and a reducing agent into water to prepare a plating solution; adjusting a pH(potential of hydrogen) of the plating solution to a range of 11.5 to 13.0 using a pH adjusting agent; dissolving 2,2'-dipyridyl into a mixed solution of water and an acid to prepare an acid solution of 2,2'-dipyridyl; and mixing the acid solution of 2,2'-dipyridyl with the pH-adjusted plating solution.
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