| 摘要 |
<p>A semiconductor manufacturing apparatus and a semiconductor manufacturing method using the same are provided to increase productivity and reliability by preventing contamination of a lithography unit due to residues. A coating unit forms a coating layer on a wafer. A lithography unit exposes and develops a photoresist layer. A scrubbing unit is formed in an inline method on a track between the coating unit and the lithography unit. The scrubbing unit includes an up/down pin(120) for supporting the wager and moving upwardly/downwardly the wafer, a rotation chuck(130) for rotating the wafer to be directed to a front surface or a rear surface of the wafer, a cylinder(140) for moving upwardly/downwardly the rotation chuck, and a RF generator(150) and a cleaning nozzle(160) for cleaning the wafer.</p> |
