发明名称 PHASE CHANGE CURRENT DENSITY CONTROL STRUCTURE
摘要 <p>A phase change memory element and method of forming the same. The memory element includes first and second electrodes. A first layer of phase change material is between the first and second electrodes. A second layer including a metal-chalcogenide material is also between the first and second electrodes and is one of a phase change material and a conductive material. An insulating layer is between the first and second layers. There is at least one opening in the insulating layer providing contact between the first and second layers.</p>
申请公布号 KR20080084832(A) 申请公布日期 2008.09.19
申请号 KR20087017183 申请日期 2006.12.12
申请人 MICRON TECHNOLOGY, INC. 发明人 DALEY JON;CAMPBELL KRISTY A.
分类号 H01L21/8247;H01L27/115 主分类号 H01L21/8247
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