| 摘要 |
The microcomponent (1) has a first wafer (2), equipped with multiple electrical connection pins (5), a second wafer (7), equipped with multiple electrical connection pads (8), intended to cooperate with the electrical connection pins (5) of the first wafer (2). The second wafer (7) has multiple first interconnection pins (10), formed on the electrical connection pads (8) of the second wafer (7), positioned facing the electrical connection pins (5) of the first wafer (2) and coming into contact with each other by nesting. An interconnection process for the first (2) and second (7) wafers of the microcomponent (1) consisting of at least the stages of the formation of the pins (5) of the first wafer (2), for example by electro-chemical growth, and of the formation of the pins (10) of the second wafer (7), for example by chemical growth. |
