发明名称 EQUIPMENT AND METHOD FOR PROCESSING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide equipment and a method for processing a substrate capable of improving productivity in a photolithographic process and reducing increase in footprint and cost, when a processing liquid is applied onto a substrate for forming a film. SOLUTION: The equipment for processing the substrate has a transfer means for transferring the substrate G with its surface turned upward on a transfer path 45, first and second processing stages 102, 103 sequentially arranged along the transferring direction on the way of the transfer path 45 to apply processing liquid R onto the substrate G, first and second nozzles 104, 111 spraying the processing liquid R onto the substrate G transferred on each of the processing stages by the transfer means, and a controlling means for controlling the operation of the transfer means and the nozzles. The controlling means alternately allocates a plurality of sequentially transferred substrate G to the first and second processing stages 102, 103, and performs the liquid application to each of the corresponding substrates G by means of the first and second nozzles 104, 111. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008160044(A) 申请公布日期 2008.07.10
申请号 JP20070016579 申请日期 2007.01.26
申请人 TOKYO ELECTRON LTD 发明人 OTA YOSHIHARU
分类号 H01L21/027;B05C5/02;B05D1/26 主分类号 H01L21/027
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