发明名称 RESIN COMPOSITION FOR FORMING RESIST PROTECTIVE FILM, AND METHOD FOR FORMING PATTERN USING THE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin composition for forming a protective film, the composition resulting in a protective film that has no affinity to an immersion liquid, can suppress elution of a low molecular weight component from a resist layer or suppress swelling of a resist film, is easily removed in an alkali development process after exposure and gives a preferable pattern profile, and to provide a method for forming a liquid immersion exposure pattern by using the above composition. <P>SOLUTION: The resin composition for forming a resist protective film contains a polymer having a repeating unit expressed by formula (1). The resin composition preferably contains a polymer having a repeating unit expressed by formula (1) as well as a (meth)acrylate repeating unit having a fluorine atom. In the repeating unit expressed by formula (1), X is more preferably a carboxylic acid. In formula (1), R1 represents a 1-20C aliphatic straight-chain or cyclic group; R2 represents a 1-20C aliphatic straight-chain or cyclic group; and X represents an alkali-soluble functional group such as -COOH, -SO<SB>3</SB>H and -CH(CF<SB>3</SB>)OH. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008158149(A) 申请公布日期 2008.07.10
申请号 JP20060345460 申请日期 2006.12.22
申请人 DAICEL CHEM IND LTD 发明人 OKUMURA ARIMICHI
分类号 G03F7/11;H01L21/027 主分类号 G03F7/11
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