| 摘要 |
PROBLEM TO BE SOLVED: To provide a gas processing apparatus that reduces variation in gas processing from one processed body to another without having to run a dummy, even when a gas is used that adsorbs to the chamber. SOLUTION: The gas processing apparatus has a chamber 40 that holds a wafer W in it, a carrying mechanism 17 for carrying processed bodies to the chamber 40 one by one, a gas supply mechanism for supplying an adsorbent raw gas for doing gassing on the wafer W in the chamber 40, and a controller 90 that controls the gas supply mechanism and the carrying mechanism, such that the processing gas is introduced into the chamber, before the first processed body is carried into the chamber; and then the first processed body is carried into the chamber, after a prescribed period of time. COPYRIGHT: (C)2008,JPO&INPIT
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