| 发明名称 |
CERAMIC PACKAGE FOR LED |
| 摘要 |
A ceramic light emitted diode (LED) package has a pair of discrete reflection walls to reflect light emission from the LED. With two opposite reflection walls and two opposite openings around the LED, light emitted from the LED package can be fanned out.
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| 申请公布号 |
US2008164487(A1) |
申请公布日期 |
2008.07.10 |
| 申请号 |
US20070675264 |
申请日期 |
2007.02.15 |
| 申请人 |
LEDTECH ELECTRONICS CORP. |
发明人 |
LIU HSIN-CHUN;WANG YAO-I;SU CHIH-LIANG;WANG FANG-PO |
| 分类号 |
H01L33/56;H01L21/00;H01L33/60;H01L33/62 |
主分类号 |
H01L33/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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