发明名称 PRINTED-WIRING BOARD, METHOD FOR MANUFACTURING PRINTED-WIRING BOARD, AND ELECTRONIC EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a printed-wiring board having built-in components capable of providing a high density circuit wiring to simplify the circuit and a high degree of freedom in consideration of a voltage drop caused by a lot of wiring, a signal leakage or the like. <P>SOLUTION: The printed-wiring board 10 comprises a first base material 11 having a component mounting surface, a built-in component 20 having through electrodes 21a, 21b mounted on the component mounting surface of the first base material 11, a second base material 12 laminated on the first base material 11 through an insulating layer 13 for covering the built-in component 20, a via hole 16 provided on the second base material 12 and jointed to the through electrode 21a of the built-in component 20 formed in a hole communicated with the through electrode 21a of the built-in component 20, and an exterior component 30 (a surface mount component) mounted on the second base material 12 and directly circuit connected to the through electrode 21a of the built-in component 20 through the via hole 16. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008159805(A) 申请公布日期 2008.07.10
申请号 JP20060346512 申请日期 2006.12.22
申请人 TOSHIBA CORP 发明人 SUZUKI DAIGO;TAKIZAWA MINORU;YAMAMOTO NOBUHIRO;TANAKA SHUSUKE
分类号 H05K1/18;H05K3/46 主分类号 H05K1/18
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