| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiator of an electronic equipment which is high in whole heat transfer rate, and is excellent in moldability. SOLUTION: First fins 1b, 1b... located in line in parallel with a tabular base board 1a to which heat is conducted from a heating element are formed integrally, and at the same time, second fins 1c, 1c... which are not in parallel with the first fins 1b, 1b... are formed integrally with the tabular base board 1a. COPYRIGHT: (C)2008,JPO&INPIT
|
