| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package that is small and of low profile, has high reliability and high flexibility of arrangement for electrodes, and to provide its manufacturing method. <P>SOLUTION: A via 4 is formed with respect to a substrate 2 of a semiconductor chip 1 so as to reach an electrode 3 from the rear side, and a conductive material 6 is embedded inside the via 4. One flat conductive plate is then placed on the rear side of the substrate 2 and is jointed to the rear-side electrode 6a. The conductive plate is then divided by etching to form a plurality of frames 7, each of which is connected to respective electrode 3 via each conductive material 6. Here, a mold resin 8 is then formed to encapsulate a semiconductor chip 1 and a frame 7. As a result, a protruding part 7a serves as an outer electrode, and a semiconductor package 11 is thus produced. <P>COPYRIGHT: (C)2008,JPO&INPIT |
